【研討會】2026泛亞太電路與系統會議 (PACCAS 2026)
2026 Pan-Asia Conference on Circuits and Systems (PACCAS 2026)
分類：演講暨研討會
對象：全校教師 , 全校職員 , 全校學生
公告單位：IC 設計所
公告人員： 李怡靜
發佈日期：2026-08-31 16:41:18
有效日期：2026-08-31 至 2026-09-11
附件：
[Please scroll down for the English version]
由國立中山大學積體電路設計研究所主辦之「2026泛亞太電路與系統會議」(2026 Pan-Asia Conference on Circuits and Systems, PACCAS)，訂於115年9月9日(三)至9月11日(五)，假國立中山大學國際研究大樓舉行。會議安排多場全英語演講，邀請國內外學者分享最新研究成果，歡迎同學踴躍報名參加。
✨演講及報名資訊✨
2026 Pan-Asia Conference on Circuits and Systems (PACCAS 2026)
會議日期：115年9月9日（三）至9月11日（五）
會議地點：國立中山大學 國際研究大樓 1F 華立廳
會議網站：https://www.paccas2026.org
報名網頁：https://forms.gle/6B3Cn5koyiZurQsj7
報名截止日：115年9月4日（五）止
本研討會由臺灣與印度的IEEE電路與系統學會社群(CASS)共同發起，作為重要交流活動，旨在推動智慧感測電路與系統設計領域的技術進步與創新應用。會議聚焦於智慧感測電路與系統的核心技術，包括微型化感測器、多模態感測、超低功耗電路、類比前端電路、人工智慧(AI)、物聯網(IoT)、記憶體內運算技術以及相關系統整合與實務驗證。
本次會議安排多場Invited Talks及Keynote Speeches，邀請國內外學者分享最新研究成果，為全英語演講，歡迎同學踴躍報名參加。
🎓 參加學生加碼：
- IC設計所及電機系學生，任選本會兩場演講，可列為1次書報；若四場演講全部參加，則列2次書報。
- 參加上午場Keynote Speech：大會提供午餐。
- 參加下午場Keynote Speech：大會提供茶點。
- 免註冊費!!!
日期 | 講者 | 講題 | 備註 |
115年09月09日 (星期三) |
| Digitally-Assisted Auto-Calibration Techniques for Analog and Mixed-Signal Circuits Against PVT and Environmental Variations | - |
| Machine Learning Algorithms for VLSI Design | ||
115年09月10日 (星期四) |
| Low-Capacitance ESD Protection for High-Speed Circuits and Systems | 提供午餐 |
| Next-Generation Power Semiconductors: From Device to Driver IC Co-Design | 提供自助式茶點 | |
115年09月11日 (星期五) |
| Bridging Silicon and Biology: AI, IoT, and IC Hardware Co-Design for Precision Aquaculture | 提供午餐 |
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The 2026 Pan-Asia Conference on Circuits and Systems (PACCAS 2026), organized by the Institute of Integrated Circuit Design, National Sun Yat-sen University, will be held from September 9 (Wednesday) to September 11 (Friday), 2026, at the International Research Building, National Sun Yat-sen University.
The conference will feature several English-language talks by researchers and scholars from Taiwan and abroad, sharing their latest research findings and developments. Students are warmly encouraged to register and participate.
✨Talk and registration information✨
2026 Pan-Asia Conference on Circuits and Systems (PACCAS 2026)
Conference Dates: September 9–11, 2026 (Wednesday–Friday)
Venue: Wah Lee Hall, 1F, Building of International Research, NSYSU
Conference Website: https://www.paccas2026.org
Registration: https://forms.gle/6B3Cn5koyiZurQsj7
Registration Deadline: September 4, 2026 (Friday)
This symposium is jointly initiated by the IEEE Circuits and Systems Society (CASS) communities in Taiwan and India. It serves as a major platform for academic exchange, aiming to advance technological progress and innovative applications in the field of intelligent sensing circuits and systems. The conference will focus on core technologies of intelligent sensing circuits and systems, including miniaturized sensors, multimodal sensing, ultra-low-power circuits, analog front-end circuits, artificial intelligence (AI), Internet of Things (IoT), in-memory computing, as well as system integration and practical validation.
The conference will feature several Invited Talks and Keynote Speeches by distinguished researchers from Taiwan and abroad. All talks will be delivered in English. Students are warmly welcome to register and participate.
🎓 Special Benefits for Students
- For students from IICD and EE: Attend any two sessions to count as one Seminar; attend all four sessions to count as two Seminars.
- Morning Keynote Speech: Lunch will be provided.
- Afternoon Keynote Speech: Refreshments will be provided.
- Registration Fee: FREE!!!
Date | Speaker | Title | Remarks |
September 9 (Wed.) |
| Digitally-Assisted Auto-Calibration Techniques for Analog and Mixed-Signal Circuits Against PVT and Environmental Variations | |
| Machine Learning Algorithms for VLSI Design | ||
September 10 (Thu.) |
| Low-Capacitance ESD Protection for High-Speed Circuits and Systems | Lunch provided |
| Next-Generation Power Semiconductors: From Device to Driver IC Co-Design | Refreshments provided | |
September 11 (Fri.) |
| Bridging Silicon and Biology: AI, IoT, and IC Hardware Co-Design for Precision Aquaculture | Lunch provided |